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OPTIM to Exhibit at 3d Systems Summit

OPTIM Wafer Services will be exhibiting at the 3D & Systems Summit at the Hilton Hotel, Dresden between 27th-29th January 2020. We look forward to seeing you there to discuss your wafer processing requirements such as Dicing, Dice Before Grinding, Taiko Grinding, Backgrinding, Thinning & Polishing, MPW thinning & dicing or Manual pick and place.

Please visit the Semi website for further details on the event:
https://www.semi.org/eu/connect/events/3d-and-systems-summit