Multi Project Wafer Dicing & Thinning

Optim Wafer Services are able to dice using the “Dice Before Grind” technique on Multi Project Wafers (MPW). If necessary, we can also manually pick and place your die into customer provided boxes.

Optical inspection, metrology and if requested die to wafer location references can also be provided.

The minimum thickness we have achieved to date is 50um.

Example shown – 200mm Wafers, with 41 reticles per wafer. Each reticle contained 17 different die.

Our Other Wafer Processing Services

Taiko Grinding

Edge Trimming

Wafer Grinding & Thinning

Wafer Polishing / CMP

Wafer Dicing

SOI Wafer Processing