Wafer Edge Trimming

Wafer edge trimming is carried out using either a dicing or back grinding tool, both can handle up to 300mm diameter wafers and are fully automated.

This service is normally required to remove the “knife edge” created when grinding and the subsequent thinning step of bonded wafers.

Our Other Wafer Processing Services

Taiko Grinding

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Wafer Dicing

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Wafer Grinding & Thinning

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Wafer Polishing / CMP

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MPW Dicing & Thinning

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