Wafer Dicing, Dice Before Grind, Resizing

Wafer Blade Dicing

Optim has two wafer blade dicing tools, that enable us to offer fast turnaround dicing services on wafers up to 300mm. We can also offer a manual pick and place service. Alternatively we can outsource an automated pick and place service for smaller chips.

Dice Before Grind (DBG)

Using a combination of wafer grinding and dicing, Optim Wafer Services can offer a Dice Before Grind Service (DBG) to singulate ultra thin die. OPTIM has demonstrated capability of thinning wafers down to ~40µ using this method.

Wafer Resizing or Coring

OPTIM is able to resize/core wafers to any smaller diameter, including making a flat or new notch.  We can also offer edge chamfering or edge rounding on the re-sized wafers.

Then using our know-how in silicon polishing and cleaning we are able to finish the wafers to reach the Semi standard specifications for both metals and LPD’s, needed to fabricate devices in a Fab.

Our Other Wafer Processing Services

Taiko Grinding

Edge Trimming

Wafer Grinding & Thinning

Wafer Polishing / CMP

MPW Dicing & Thinning

SOI Wafer Processing