Wafer & Die Grinding or Thinning

Capabilities

Optim Wafer Services has the ability to offer both wafer & individual die grinding or thinning services for one off needs, volume production or prototype products.

We are able to grind 100mm – 300mm Silicon wafers down to ~10µ and have demonstrated die thinning to 100um.

In addition we are also able to grind Sapphire, Quartz, Glass & Germanium substrates. The use of protective tape and UV plasma de-stressing is also available.

Our Other Wafer Processing Services

Wafer Polishing / CMP

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Wafer Dicing

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Taiko Grinding

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Edge Trimming

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MPW Dicing & Thinning

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