Wafer & Die Grinding or Thinning


Optim Wafer Services has the ability to offer both wafer & individual die grinding or thinning services for one off needs, volume production or prototype products. We are able to grind 100mm – 300mm Silicon wafers down to ~10µ and have demonstrated die thinning to <50um. In addition we are also able to grind Sapphire, Quartz, Lithium Tantalate, Glass & Germanium substrates. The use of protective tape and UV plasma de-stressing is also available.

Our Other Wafer Processing Services