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Utilising Optim Wafer Services’ unrivalled wafer polishing skills, we are able to polish or CMP the following materials.
Typical requests for this type of service require high precision in terms of the control of the material to be removed. Some requests require us to CMP only 1-2µ of material. The typical applications for this wafer CMP service include:
Optim Wafer Services is able to offer additional Double side polishing of substrates for the following types of applications:
Typically we are able to achieve low Ra with Semi Standard levels of Metallics and Defects.