Semicon Europa 2019 Exhibition - Optim Wafer Services

Optim to Exhibit at Semicon Europa

7th October 2019

Optim Wafer Services will be exhibiting at Semicon Europa from 12th-15th November 2019. Please come and visit us at Booth 1257 to discuss your wafer processing requirements. Optim offers a range of services such as wafer thinning & polishing, edge trimming, cleaning, dicing, dice before grinding, Taiko grinding, die thinning and combinations of any of the above.

Please visit the Semicon website: semiconeuropa.org

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