22nd European Microelectronics and Packaging Conference (EMPC) & Exhibition

OPTIM Wafer Services will be exhibiting at the EMPC Conference and Exhibition taking place in Pisa, Italy between the 16th & 19th of September 2019. We look forward to seeing you there to discuss your wafer processing requirements such as Dicing, Dice Before Grinding, Taiko Grinding, Backgrinding, Thinning & Polishing, MPW thinning & dicing or Manual pick and place. Visit the EMPC 2019 website.