OPTIM Wafer Services will be exhibiting at the EMPC Conference and Exhibition taking place in Pisa, Italy between the 16th & 19th of September 2019. We look forward to seeing you there to discuss your
wafer processing requirements such as
Dicing,
Dice Before Grinding,
Taiko Grinding, Backgrinding,
Thinning &
Polishing,
MPW thinning & dicing or
Manual pick and place.
Visit the
EMPC 2019 website.