The new wafer processing line investment announced last year has now been completed, on time and on budget

This line includes the purchase and installation of a DISCO DAG840 – Automatic cassette to cassette grinder with two grinding heads, 100mm - 200mm capable, DI Rinse head, Tape & De-Tape Systems with UV activation and an Optical Metrology system.

This investment will increase Rockwoods grinding capacity to ~40K wpa.

More importantly, it will allow Rockwood to further develop it’s business diversification plan. Below are some examples of the types of projects and value added wafer processing services Rockwood is able to offer it’s customers.

• Wafer Resizing.
• Wafer Edge Trimming.
• Wafer Grinding & Dicing.
• Double Side CMP Polishing for TSV’s or SOI Substrates.
• Standard product wafer backgrinding.
• Wafer Thinning & Double side polishing for bonding preparation.
• Wafer Thinning & Double side polishing for Fabrication of Sensors.
• Handle wafer thinning or removal.
• Layer transfer processing.
• Prototype Dicing.

In addition Rockwood makes use of it’s Class 1 cleanroom and State of the art cleaning systems to be able to offer both Low Defects and Low Surface metallics where required.