Rockwood announces enhanced metrology capabilities through their involvement in the Micropacks platform located in Gardanne.

The platform has recently bought a FOGAL Nanotech 3D Dual system, which will enhance our ability to measure transparent substrates such as Sapphire or quartz wafers or control critical parameters when processing bonded substrates that require thinning and or edge trimming services. i.e.

IR Microscopy

Wafer on carrier process control – Offers full wafer on carrier dimensional control including Bow, Warp & TTV plus edge trim dimensional control, backside roughness and bonded interface inspection.

Backside Processing

Using IR Microscopy plus interferometry, both wafer thickness and TSV depth can be measured simultaneously. Pattern recognition is also available.