Capital Equipment Investment

OPTIM has recently bought the following systems to further expand and strengthen our position as a leading player in the field of wafer processing and wafer reclaim.

DISCO DFG 850 Wafer Grinder.The 2^nd grind tool located in our plant in Greasque. Commissioning will take place over the summer period and once qualified will double OPTIM’s grinding capacity on diameters up to 200mm.

Double Side Scrubber. The 4^th system in OPTIMS reclaim line, was installed, commissioned in Q125. Currently in the qualification stage. It will help to de-bottleneck our 200mm reclaim line.

Wafer Laser Marker. A new system that will replace one of the existing two laser markers OPTIM possesses. Due to be delivered and installed ~Q425.

Quality Audit. The LRQA will conduct their annual audit of OPTIM’s quality systems in Q325.