Taiko Grinding, Wafer Processing, Wafer Reclaim Services

Contact Us

enquiries@optimwaferservices.com
+33 (0)442 126 130

close »

Have a question

Or need a free quote?

Click Here to Contact Us

Taiko Grinding

Optim Wafer Services is able to offer a Taiko grinding service.

This technique leaves ring of full thickness silicon around the outer edge of the wafer while the area where the devices are, can be thinned to as low a 100um and still allow backside processing to occur with no major adaptions to process equipment. Once complete, this ring is removed prior to dicing and assembly.

 

Make an Enquiry

See all Wafer Processing Services

 

Have a question or would like a free quote?

Fill out the form below and we will be in touch shortly