Wafer Dicing, Dice Before Grind, Resizing | Optim Wafer Services

Contact Us

+33 (0)442 126 130

close »

Have a question

Or need a free quote?

Click Here to Contact Us

Wafer Dicing, Dice Before Grind, Resizing

Wafer Dicing

Optim has two wafer dicing tools, that enables us to offer low volume but fast turnaround dicing services on wafers up to 300mm.

Dice Before Grind (DBG)

Using a combination of wafer grinding and the dicing, Optim Wafer Services can offer a Dice Before Grind Service (DBG) to singulate ultra thin die. OPTIM has demonstrated capability of thinning wafers down to 10um using this method.

Wafer Resizing

By using the circle cut funtion on the dicing saws, we are able to resize wafers to any smaller diameter, including making a flat.  We can also offer edge bevelling or edge rounding on the re-sized wafers. Then using our know how in silicon polishing and cleaning we are able to finish the wafers to low LPD's & Metallics sufficient to fabricate devices in your Fab.


Make an Enquiry

See all Wafer Processing Services


Have a question or would like a free quote?

Fill out the form below and we will be in touch shortly