Process Development, Wafer Processing, Wafer Reclaim Services

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Process Development

By using our extensive expertise in the key processing techniques below, OPTIM is able to offer a one stop shop approach to process development.

In addittion. by working with partners, we are also able to expand this service to include Layer deposition, Oxidation growth and Photolithography & Etching.

KEY OPTIM PROCESSING SKILLS:- Grinding, Thinning, Polishing, CMP, Edge Trimming, Wafer Re-sizing, Die Thinning, Dicing, Dice Before Grind, Taiko grind, Wafer Bonding, Cleaning & Metrology..

 

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