Process Development, Wafer Processing, Wafer Reclaim Services

Contact Us
+33 (0)442 126 130

close »

Have a question

Or need a free quote?

Click Here to Contact Us

Process Development

By using our extensive expertise in the key processing techniques below, OPTIM is able to offer a one stop shop approach to process development.

In addittion. by working with partners, we are also able to expand this service to include Layer deposition, Oxidation growth and Photolithography & Etching.

KEY OPTIM PROCESSING SKILLS:- Grinding, Thinning, Polishing, CMP, Edge Trimming, Wafer Re-sizing, Die Thinning, Dicing, Dice Before Grind, Taiko grind, Wafer Bonding, Cleaning & Metrology..


Have a question or would like a free quote?

Fill out the form below and we will be in touch shortly