New Dicing Line Investment

Rockwood Wafer Reclaim announces that it is has secured an investment of the installation of a complementary wafer dicing line to be situated in its Greasque Site in France.

The investment consists of:

- 1 x DFD 651 automatic wafer dicing tool and a Stand-alone Taping System

This investment will increase Rockwood’s capacity, return time and flexibility in it's wafer dicing services already offered and is in addition to the 300mm DFD 6361 tool operated by Rockwood. Both these tools offer state of the art saw dicing processes, that produce the lowest chip out levels coupled with highly accurate cutting control.

Enabling Rockwood to offer the following services:-

  • Dice Before Grind
  • Wafer Dicing
  • Wafer Edge Trimming / Chamfering
  • Circle Cut
  • Wafer Re-Sizing

The installation and commissioning of the tool will occur in Q1/2015 and the production will start in Q2/2015. This investment will more than double Rockwood’s current wafer dicing capacity and enable us to offer the shortest return times and maximum flexibility expected by our customers.