Rockwood joined the OPTIM Project

Rockwood joined the OPTIM” Project – A 2.9 M€ R&D project managed by Rockwood.

The project is supported by SCS, ARCSIS & will start in September 2008 with local Semiconductor Manufacturers, Equipment makers with the primary aims of Improving the knowledge and characterisation of sub surface silicon defects by understanding the mechanisms by which defects are made visible by an SP1.

To develop a non destructive inspection tool, to help determine the reclaim potential of each wafer and develop processes which will improve reclaim potential of each individual wafer to defect sizes down to 65 nm.

Rockwood Wafer reclaim has joined the MICROPACKS platform in Gardanne for the development of advance packaging techniques. This R&D facility will enable Rockwood to offer grinding and thinning services on 200 & 300m wafers from October 2008.