Investment announcement

The wafer thinning/grinding program has expanded rapidly in the last two years to the point where Rockwood has identified the need to increase both capacity & return times to meet that demand.

• A third production line is to be installed at our plant in Greasque.
• Rockwood Specialties Inc. has demonstrated it’s continued support to Wafer Reclaim by approving a $650K investment that will be completed in Q1 2011.
• This investment will increase wafer grinding capacity to ~40K pa.
• The investment will include the following.
  • DISCO DAG840 - Automatic cassette to cassette grinder with two grinding heads, 100mm - 200mm capable, DI Rinse head.
  • Tape & De-Tape Systems with UV activation.
  • Optical Metrology system.