Rockwood announces the addition of wafer dicing capabilities to it’s wafer processing portfolio of services

16th September 2011

As part of the Micropacks platform based at the university of Gardanne Rockwood has access to a DISCO DFD6361 Automatic Dicing Saw, capable of processing 100mm to 300mm wafers.

Rockwood personnel are trained to use this system and already our technicians and engineers are working on Circle Cut Wafer Re-sizing and Edge Trimming projects with our customers.

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