The new wafer Grinding & CMP line is now certified

Rockwood can announce that following a recent audit of it’s facilities and systems, that the new Wafer Grinding & CMP line is now certified to the ISO 9001 V2008, ISO 14001 V2004 and OHSAS 18001 V2007 standards alongside the wafer reclaim production facilities.

In a joint statement the Director of Operations, Jean Christophe Millet and the European Sales & Marketing Director Mr. Georges Peyre said “That this certification demonstrates to our customers the commitment we have to our quality systems and forms part of Rockwood’s continuous improvement program and ongoing quality integration policy.”