Rockwood Wafer Reclaim demonstrates capabilities for wafer edge trimming

6th February 2012

Removing or, shaping the edge of a wafer is becoming mandatory for some specific applications. For example, a wafer is thinned as part of the process flow and still facing further processing steps.

A typical application is when using a carrier wafer to enable backside processing of thin wafers. The edge of the thin wafer gets sharp and very fragile, making any further process steps very difficult to manage.

Removing the edges reduces this drawback.

Rockwood Wafer Reclaim demonstrates capabilities for wafer edge trimming.

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