Wafer Processing, Wafer Reclaim Services

Ultra Thin Dice Before Grinding

27th June 2012

Rockwood has recently demonstrated it's ability to process ultra thin wafers.

In a project for a major European customer we were required to make 50um thick die from 200mm wafers. Using our Dice Before Grind process, Rockwood successfully managed this challenging task.

We are also engaged in development work to thin and dice wafers to 25um thick.

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