Wafer Processing, Wafer Reclaim Services

Rockwood at “Be Flexible” Forum

28th December 2012

Rockwood made a presentation at recent "Be Flexible" forum hosted by the Fraunhofer Institute EMFT in Munich held in late November.

This is a technical conference that brings together research establishments, institutes and companies to share their respective experiences in the technology push towards processing and handling of ever thinner substrates.

The presentation made by Rockwood looked at the process issues that we experienced and subsequently overcame during the development of a Medical device with a major customer.

The presentation is available to view or download.

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