Process Development, Wafer Processing, Wafer Reclaim Services

Contact Us

enquiries@optimwaferservices.com
+33 (0)442 126 130

close »

Have a question

Or need a free quote?

Click Here to Contact Us

Optim completes 2017 capacity increase Read More

Process Development

By using our extensive expertise in the key processing techniques below, OPTIM is able to offer a one stop shop approach to process development.

In addittion. by working with partners, we are also able to expand this service to include Layer deposition, Oxidation growth and Photolithography & Etching.

KEY OPTIM PROCESSING SKILLS:- Grinding, Thinning, Polishing, CMP, Edge Trimming, Wafer Re-sizing, Die Thinning, Dicing, Dice Before Grind, Taiko grind, Wafer Bonding, Cleaning & Metrology..

 

Have a question or would like a free quote?

Fill out the form below and we will be in touch shortly